Portland Community College | Portland, Oregon

This is the second course in a three course set: MT 101, MT 102, and MT 103 or MT 104. The set is required for graduation with the Certificate of Completion or the AAS degree in Microelectronics Technology, with or without the Solar Voltaic Manufacturing option.

This course may be offered in an on-campus format or in a distance learning format on the world-wide-web.

• Describe basic construction and operation of semiconductor devices, with industry professionals.
• Explain the fundamentals of how these devices operate, with industry professionals.
• Use developed abilities and habits in the information methods of the industry to communicate and find information on: business news, processes, advances, technical data, etc

Course activities will include a variety of learning activities, such as: instructor delivered lectures, demonstrations, and/or student discussions stressing key topics in the course. In preparation for the lecture portion of the course, students will be expected to complete all reading and problem/question homework assignments.

Assessment of student performance in this course will consist of written examinations. Assessment may also include oral presentations, written reports, and other class projects.

3. Semiconductor Materials
3.1. Identify the parts of an atom. Provide sketches to describe the atomic structure of a given atom (e.g. carbon, silicon, and germanium).
3.2. Describe an atom, ion, and molecule. Use sketches as appropriate.
3.3. List three semiconducting materials.
3.4. Name the two unique properties of a doped semiconductor: precise resistivity control through doping and electron and hole conduction.
3.5. Describe the difference in composition and electrical functioning of n-type and p-type semiconductor materials.
3.6. Describe the mechanism for conduction in n-type and p-type semiconductor materials.
4. Crystal Growth and Wafer Preparation
4.1. Define the following terms: crystalline, polycrystalline, and amorphous.
4.2. Define the terms: Miller index and crystal plane.
5. Overview of Wafer Fabrication
5.1. Draw a cross-sectional view of a MOS transistor and label the source, drain, gate, and gate oxide.
5.2. Describe the basic on/off switching operation of a MOS transistor.
 

2.5 Describe the sequential processes (i.e. the process flow)

used in manufacturing a MOS transistor.

2.6. Define the terms: layering, patterning, and doping.

12. Test, Sort, and Packaging
12.3. Describe the parametric tests performed on a die.
 

1. Semiconductor Materials

2. PN junction, The cellular Cell and CMOS

2.1 Describe the mechanism for conduction in n-type and p-type semiconductor materials.

2.2 Describe how a diode and a solar cell work.